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Automatic
wafer load / unload |
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6''
and 8'' wafers, 12'' on request |
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Auto
alignment |
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Automatic
measurement sequence : |
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.
Bump dimensions
. Roughness (grinding, local stress)
. Step height
. Film thickness (photoresist, oxide,...) |
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Custom
report format : |
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.
Chip per chip statistics
. Wafer per wafer statistics
. Temporal evolution of process parameters over several months |
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For
more information download the data
sheet |
